Taixin Semiconductor

News detail

Three-Time Honor, Market-Validated | Taixin Wins the 21st "China Chip" Outstanding Market Performance Product Award

2026-11-02

November 1–4 2026 "China Chip" Integrated Circuit Industry Promotion Conference and the Results Release Ceremony for the 21st "China Chip" Outstanding Product Selection was held i…

November 1–4

2026 "China Chip" Integrated Circuit Industry Promotion Conference

and the Results Release Ceremony for the 21st "China Chip" Outstanding Product Selection

was held in Hengqin, Zhuhai

Independently developed by Taixin Semiconductor

audio-video Wi-Fi/Bluetooth/NearLink tri-mode SoC chip

TXW82X was recognized as

an Outstanding Market Performance Product

This is the company's third "China Chip" award

and the second award for TXW82X

At the conference

This year's conference was held from November 1 to 4 in Hengqin and Macao under the theme "Intelligence Enlightens the Chip Journey, Collaboration for Shared Growth," linking the main venue in Hengqin with the international venue in Macao and bringing together chip companies, research institutions, industrial capital, and professional service resources.

During the conference, Taixin Semiconductor set up a booth to showcase a range of its commercial chips and terminal devices powered by these chips, and exchanged views with industry partners on wireless solutions for various terminal devices.

02

Two Chips

Three Awards

Established in 2006, the "China Chip" Outstanding Product Selection remains application-oriented. It is one of the most authoritative and influential annual selections in China's integrated circuit field and is regarded as a bellwether for the development of China's chip products and technologies.

17th "China Chip"

2022

Xinhuo Rising Star Product Award

Award-winning product: TXW8301

A Wi-Fi HaLow™ chip for long-range, low-power IoT scenarios.

20th "China Chip"

2025

Outstanding Technological Innovation Product Award

Award-winning product: TXW82X

TXW82X is a tri-mode integrated audio-video SoC that integrates three wireless protocols—Wi-Fi, Bluetooth Low Energy (BLE), and NearLink—into a single chip.

21st "China Chip"

2026

Outstanding Technological Innovation Product Award

Award-winning product: TXW82X

The same chip has made the list for a second time, with the review now focusing on mass-production scale and customer-side deployment. The TXW82X series has covered pocket gimbal cameras, detachable action cameras,HD video multi-party intercomand other terminals.

03

Audio and Video Wireless

TXW82X Series

TXW82X targets audio/video wireless transmission scenarios. The chip integrates three wireless protocols—Wi-Fi, Bluetooth Low Energy (BLE), and NearLink—each with its own focus: Wi-Fi for high-speed video transmission, BLE for low-power network provisioning and classic connectivity, and NearLink for real-time interaction thanks to its low latency and anti-interference characteristics. For end products, these connectivity capabilities can be implemented by a single chip, eliminating the need for multiple external wireless modules and helping simplify overall device design and supply chain management.

Based on this platform, the TXW82X series covers multiple product forms:

• TXW827-C08

Targeting handheld pocket gimbal cameras, it integrates capture, encoding, display, and wireless transmission, and is equipped with 8MB PSRAM and 2-lane MIPI DSI. Face tracking runs in software on the chip's CPU, requiring no external algorithm chip or additional NPU, and does not affect encoding or display when enabled.

• TXW826-824

Targeting detachable action cameras, it uses a QFN48, 5×5 mm package and is the smallest device in the series. It integrates 2MB Flash on-chip, eliminating the need for external memory components.

• TXW827-C04F

Targeting HD video intercom products, it has a built-in ISP and H.264 hardware codec, and supports 2-megapixel cameras and one master with multiple slave units.

These are only a small subset of the TXW82X series' applications.

At present, the TXW82X series has deployed solutions in scenarios such as AI glasses, HD drone video transmission, video doorbells, law enforcement recorders, wireless IPCs, small appliances with displays, baby monitors, and pet cameras.

The chip supports dynamic power management, with current in low-power mode reduced to around 74 μA, and supports bidirectional wake-up, making it suitable for devices that remain on standby for long periods, such as smart locks and video doorbells.

04

Long-Range IoT

TXW8301

TXW8301 targets long-range IoT scenarios: devices are widely distributed, wiring or battery replacement is inconvenient, and long-term online operation is required. The chip is developed based on the Wi-Fi HaLow™ standard, with a transmission distance of up to 1.5 km, support for up to 8,191 nodes per network, and low power consumption on the order of 200 μA. Taixin is one of the first companies in the world to achieve mass production of Wi-Fi HaLow™ chips.

TXW8301 primarily targets NVR security surveillance, wireless routers, and industrial and agricultural IoT scenarios that place high demands on transmission distance and penetration capability.

This award is a strong affirmation of Taixin Semiconductor's technical strength and market performance, as well as recognition of the company's long-term commitment to independent R&D.

In the future, Taixin will take this award as a new starting point, continue to increase R&D investment, continuously enrich its product portfolio, and promote the deployment and application of its chip products in more scenarios such as AIoT, security surveillance, and industrial IoT. Together with industry chain partners, the company will contribute to the high-quality development of China's integrated circuit industry.

Zhuhai Taixin Semiconductor Co., Ltd. was founded in November 2016. It is a national-level specialized, refined, distinctive, and innovative 'Key Little Giant' enterprise focused on chip design for the AIoT field, and has been listed on the 'China IC Unicorn' list. Thanks to its outstanding technical strength, the company's products have won the prestigious 'China Chip' industry honor three times.

The company has deep expertise in core technologies for wireless communication and audio/video processing, with full-stack independent R&D capabilities across baseband, protocol stack, and RF circuits. As one of the first companies globally to achieve mass production of Wi-Fi HaLow™chips, Taixin has established a first-mover advantage in the long-range IoT field with its superior penetration and ultra-low power consumption. At the same time, the company has taken the lead in launching audio/video SoC chips integrated with NearLink technology, fully empowering cutting-edge audio/video scenarios such as AI glasses, HD drone video transmission, and video doorbells with low latency and strong anti-interference performance.

In terms of technology layout, the company has made a forward-looking investment in LTE Cat.1 chips, further improving its mid-rate IoT technology portfolio and successfully building a dual-technology-driven system of 'wireless + cellular.' Its product portfolio fully covers ultra-long-range, low-power, multi-protocol convergence, and complex industrial-grade scenarios, broadly empowering diverse fields such as consumer electronics, security surveillance, smart home, embodied robots, connected vehicles, and industrial internet. It has also gained recognition from many leading customers, including Hikvision, and achieved large-volume shipments.

As an active promoter of the industry ecosystem, Taixin Semiconductor is a formal member of the Wi-Fi Alliance, SparkLink Alliance, Wi-SUN Alliance, and RISC-V Alliance. In the future, the company will continue to uphold its corporate culture of "Diligence, Innovation, Pragmatism, and Growth" and, through continuous technological innovation and application expansion, provide global customers with high-performance, stable, reliable, and cost-effective one-stop AIoT chips and solutions, helping to drive the thriving development of the era of ubiquitous intelligent connectivity.

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